HIOKI In-circuit Testers

Flying Probe ICT with AOI Functions

• Evaluates solder joints between lands and leads by resistance testing

• 40 steps/sec. measuring rate

• AOI function checks component presence, polarity and displacement

• Soft-landing probes to prevent board damage

• Minimum probing pitch of 0.2mm

• Fast fixture-less setup

• Optional Tecnomatix Unicam CAD conversion software

1220 Bed-of-Nails (BON) In-Circuit Tester

• High-speed and efficient in-circuit testing

• Automatic Test Generation (ATG) function

• Remote self-diagnostic feature

• Data stored in CSV format for off-line analysis

• Wide range measurement capabilities

• Compact, space-saving footprint

• User-friendly Windows® 2000/XP operation

1220 Benchtop Model

• Flexible and cost-effective

• Adaptable to third-party BON fixtures

• HIOKI 1240

• HIOKI 1220-00 / 1220-02