MS9000SAN for all round

BGA Rework Station

Detail Information

BGA Reworksystem

Equipment Size

650mm(W) x 860mm(D) x 730mm(H) / 80Kg

Max.PCB size

  • Standard: 400mm(W) x 300mm(D)

  • Optional: 510mm(W) x 400mm(D)

Max. component Height

Top-45mm / Bottom-25mm

Max. component size for vision system

50mm x 50mm

Board thickness

0.5-3.5mm / 3kg

Top convection heater

1040VA

Bottom IR heater

  • Standard: 1000VA

  • Optional: additional 3000VA

PID control

Yes

Touch panel operation

Yes

Power 200 / 220 / 240V single phase

Yes

Pneumatic requirement

0.5Mpa

Placement accuracy

±0.025mm

General Information

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